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Electroplating of Nickel and Copper Layers on Nanoengineered Plastics

Faculty Mentor

Dr. Muralidhar K. Ghantasala

Presentation Date

4-11-2014

Document Type

Poster

Abstract

Introduction

  • The motivation for this project is the development and proposed use of novel nanoengineered polymeric materials in many industrial and commercial applications. This necessitated the development of a robust metallic coating that can withstand aggressive environmental conditions.
  • This research explores the methods of electroplating nickel and copper to the substrate, including the effects of various duty cycles and cathode current density

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