The micro-laser assisted drilling (µ-LAD) of monocrystalline silicon (100), using a diamond cutting tool coupled with a laser, was tested in order to improve the cutting edge quality of a drilled samples. The laser beam is transmitted through an optically transparent diamond drill bit and focused precisely at the tool-workpiece interface, where the material is under high pressure induced by the diamond tool. The influence of the laser power on the quality and the inner surface finish of the drilled materials is investigated. Different laser powers were used to carry out the experiments. The experimental results indicated that the µ-LAD tests were successful in making precise holes on the silicon (100) samples with high edge quality due to using a laser compared to the case drilled with no laser.
Preferred Citation Style (e.g. APA, MLA, Chicago, etc.)
"Quality Improvement in Drilling Silicon by Using Micro Laser Assisted Drilling,"
The Hilltop Review: Vol. 9
, Article 8.
Available at: http://scholarworks.wmich.edu/hilltopreview/vol9/iss1/8