Date of Award
Master of Science in Engineering
Industrial and Manufacturing Engineering
Dr. John A. Patten
Dr. Leonard Lamberson
Dr. Steven Butt
Dr. Tarun Gupta
Masters Thesis-Campus Only
This work was focused on the analysis of a new process called micro Laser Assisted Machining (u-LAM). It is a ductile mode machining process being researched for machining of nominally hard and brittle ceramic and semiconductor materials like Silicon Carbide (SiC).
Numerical simulations were conducted using the finite element metal machining software 'AdvantEdge' to study the material behavior during the u-LAM process. The simulation model uses the pressure sensitive Drucker-Prager yield criterion to accommodate the material behavior due to a High Pressure Phase Transformation (HPPT). Various heating effects were created to mimic the actual machining process (laser heating and thermal softening). A realistic thermal softening curve was developed based on various references to simulate the thermal softening material behavior. A stress and temperature interaction study was done to identify the relative (percentage) contribution due to pressure (and HPPT) and temperature (thermal softening) during the u-LAM process. The cutting and thrust forces and the cutting pressures were compared at various temperatures of SiC to study the material behavior during the u-LAM process.
Virkar, Saurabh R., "Numerical Simulations and Analysis of Ductile Mode Micro Laser Assisted Machining of Silicon Carbide" (2010). Master's Theses. 381.