Dr. Muralidhar K. Ghantasala
- The motivation for this project is the development and proposed use of novel nanoengineered polymeric materials in many industrial and commercial applications. This necessitated the development of a robust metallic coating that can withstand aggressive environmental conditions.
- This research explores the methods of electroplating nickel and copper to the substrate, including the effects of various duty cycles and cathode current density
WMU ScholarWorks Citation
Voelker, Brandon; Ghantasala, Muralidhar K.; and Wheeler, Jeff, "Electroplating of Nickel and Copper Layers on Nanoengineered Plastics" (2014). Research and Creative Activities Poster Day. 111.