Screen Printing of Multi-layered Hybrid Printed Circuit Boards on Different Substrates
Dr. Massood Atashbar
Electrical and Computer Engineering
This poster reports on the successful fabrication of a multilayered hybrid printed circuit board (PCB) for applications in the consumer electronics products, medical technologies, and military equipment. The PCB was fabricated by screen-printing silver (Ag) flake ink, as metallization layer, and UV acrylic-based ink, as dielectric layer, on different substrates such as paper, polyethylene terephthalate, and glass. Traditional electronic components were attached onto the printed pads to create the multilayered hybrid PCB. The feasibility of the hybrid PCB was demonstrated by integrating an embedded microcontroller to drive an liquid-crystal display (160 × 100 pixels)
WMU ScholarWorks Citation
Eshkeiti, Ali, "Screen Printing of Multi-layered Hybrid Printed Circuit Boards on Different Substrates" (2015). Research and Creative Activities Poster Day. 158.
This poster was presented at the 2015 Western Michigan University Research and Creative Activities Poster Day. The poster and abstract are currently unavailable through ScholarWorks.