Pringles Chip Cooling
Date of Defense
4-14-2020
Date of Graduation
4-2020
Department
Chemical and Paper Engineering
First Advisor
James Springstead
Second Advisor
Peter Parker
Abstract
The demand for Kellogg’s products is growing around the world, with an expected need to increase the production rate of some products by 30%. Cooling is a known bottleneck in the manufacturing of Pringle chips, so there is a need to find an efficient way to cool the chips before seasoning and the seaming of the can. The previous design is subjected to material and energy balance analysis. To address this issue a modification to the process is designed and recommended for implementation. This improved knowledge will lead to optimization of equipment performance and minimization of capital expenses.
Recommended Citation
Dosh, Austin, "Pringles Chip Cooling" (2020). Honors Theses. 3246.
https://scholarworks.wmich.edu/honors_theses/3246
Access Setting
Honors Thesis-Restricted
Comments
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